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1. Sample detection and recognition stage:

When the project or business delivers samples, the products must be rigorously tested and checked:

A product size, especially the important parts and wall thickness required by customers as the focus of control.

B strength test, the general skeleton can reach 3Kgf, the strength is relatively small when the structure is thin or the product is small.

C withstand voltage test, through high voltage test (such as 3, 5KV, 2mA, 60S withstand voltage conditions), can avoid the pressure tolerance caused by material selection and wall thickness is not reasonable in the design stage.

D solder test, test the tin on the pins, and the deformation and blistering of the body after an instant (1-3S) high temperature.

E product flatness, test the bottom bump or plane in contact with the PCB board, whether there is warpage deformation, the general industry with 0,1mmmax as the standard of control, the larger the skeleton, can relax the flatness size. At present, the stitching of the frame-type skeleton is the most strict, because the stitch flatness is the control point directly related to the PCB flat post.

When the F customer requests CPK control over important parts, it is necessary to increase the CPK confirmation.

After the customer acknowledges the product, the customer should retain the approval of the sample delivery product and the customer's return.

H data files (product specification drawings, operation standards, full inspection instructions, packaging specifications, etc.) need to be issued to relevant departments for the subsequent control of product quality during mass production.

When the I skeleton is changed, the change logo is made on the drawing surface, and the detailed record of the version change is added. At the same time, the product before the change is isolated to avoid the product mix before and after the mold change.

2. Skeleton production stage

1 injection molding

The process is that the molten wood raw material and the plastic material in a high temperature state are sprayed into the skeleton mold cavity by the pressure of the injection molding machine, and after a certain molding and cooling time, the skeleton is separated from the mold through the ejection system. The focus of this process control is the temperature and pressure at the time of injection, and the ratio of recycled materials in the plastic material. The change in injection temperature and pressure must affect the change of the basic size of the product, the change of product strength and characteristics, and the thickness variation of the burrs. The thickness of the burrs will directly affect the operation of the next process. This process can be monitored by the PQC import SPC to detect changes in the series, so that changes can be found as early as possible, and adjustments can be made as early as possible to ensure the quality of the products. For the finished mold, timely cleaning and maintenance are needed to extend the service life of the mold and bring more benefits to the enterprise. Transformer skeleton

2 raw edge processing

This process is mainly for the bakelite skeleton. In order to smoothly discharge the gas generated during the molding process, we need to add a venting groove to the mold. The molten raw material fills the venting groove under the action of high pressure, so we need to pass For the specific process, the raw edge is processed by a flashing machine. In the management of the burrs, we need to measure the size of the product to determine whether the size of the skeleton is affected by the thickness of the burrs. In addition, it is generally determined whether the burrs are transparent or not.

In the process of raw edge processing, we should choose the size of the sand according to the structural characteristics of the product, such as the size of the wire trough and the strength of the product. Otherwise, the sand will be stuck in the wire trough to block the copper wire, or it may be stuck in the pinhole to affect the next pin. Do not perform burr processing after the pin, otherwise it will affect the verticality of the pins.

For plastic products, only by hand. SMD-based bakelite products can be processed through a tunnel-type burr machine, and the burrs attached to the terminals are manually removed.